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june 2010 doc id 10176 rev 2 1/11 11 stth2002c high efficiency ultrafast diode features suited for smps low losses low forward and reverse recovery times low leakage current high junction temperature insulated package: to-220fpab description dual center tap rectifie r suited for switch mode power supplies and high frequency dc to dc converters. packaged in to-220ab, d 2 pak, to-220fpab and i 2 pak, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. table 1. device summary symbol value i f(av) up to 2 x 10 a v rrm 200 v t j (max) 175 c v f (typ) 0.78 v t rr (typ) 22 ns to-220ab stth2002ct i 2 pa k stth2002cr d 2 pa k stth2002cg to-220fpab STTH2002CFP a1 a2 k a1 a2 k a1 a2 k a1 a2 k a1 a2 k k www.st.com
characteristics stth2002c 2/11 doc id 10176 rev 2 1 characteristics when the diodes 1 and 2 are used simultaneously: t j (diode1) = p (diode1) x r th(j-c) (per diode ) + p (diode2) x r th(c) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) forward rms current 30 a i f(peak) avarage forward current = 0.5 i 2 pak, d 2 pa k , to-220ab t c = 150 c per diode 10 a t c = 140 c per device 20 a t c = 130 c per diode 15 a t c = 115 c per device 30 a to-220fpab t c = 120 c per diode 10 a t c = 85 c per device 20 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 90 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature 175 c table 3. thermal parameters symbol parameter value (max) unit r th(j-c) junction to case i 2 pa k , d 2 pak, to-220ab per diode 2.5 c/w per device 1.6 to-220fpab per diode 5 per device 3.8 r th(c) coupling i 2 pa k , d 2 pak, to-220ab 0.7 to-220fpab 2.5
stth2002c characteristics doc id 10176 rev 2 3/11 to evaluate the conduction losses use the following equation: p = 0.73 x i f(av) + 0.020 i f 2 (rms) table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 10 a t j = 125 c 6 100 v f (2) forward voltage drop t j = 25 c i f = 10 a 1.1 v t j = 25 c i f = 20 a 1.25 t j = 150 c i f = 10 a 0.78 0.89 t j = 150 c i f = 20 a 1.05 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 % table 5. dynamic electrical characteristics symbol parameter test conditions min. typ. max. unit t rr reverse recovery time t j = 25 c i f = 1 a, v r = 30 v di f /dt = 100 a/s 22 27 ns t fr forward recovery time t j = 25 c i f = 10 a, di f /dt = 100 a/s v fr = 1.1 x v fmax 200 ns v fp forward recovery voltage t j = 25 c i f = 10 a, di f /dt = 100 a/s 2.4 v i rm reverse recovery current t j = 125 c i f = 10 a, v r = 160 v di f /dt = 200 a/s 7.0 9.0 a
characteristics stth2002c 4/11 doc id 10176 rev 2 figure 1. peak current versus duty cycle (per diode) figure 2. forward voltage drop versus forward current (typical values, per diode) 0 10 20 30 40 50 60 70 80 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 i (a) m t =tp/t tp i m p = 20w p = 10w p = 5w 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 v (v) fm i (a) fm t =25c j t =150c j figure 3. forward voltage drop versus forward current (maximum values, per diode) figure 4. relative variation of thermal impedance junction to case versus pulse duration 0 10 20 30 40 50 60 70 80 90 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 i (a) fm v (v) fm t =25c j t =150c j z/r th(j-c) th(j-c) 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t (s) p to-220ab, d pak, i pak 22 figure 5. relative variation of thermal impedance junction to case versus pulse duration (to-220fpab) figure 6. junction capacitance versus reverse voltage applied (typical values, per diode) 0.0 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 z/r th(j-c) th(j-c) single pulse t (s) p 10 100 0 50 100 150 200 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j
stth2002c characteristics doc id 10176 rev 2 5/11 figure 7. reverse recovery charges versus di f /dt (typical values, per diode) figure 8. reverse recovery time versus di f /dt (typical values, per diode) 0 50 100 150 200 250 300 10 100 1000 q (nc) rr di /dt(a/s) f i =10a f v =160v r t =125c j t =25c j 0 10 20 30 40 50 60 70 80 10 100 1000 t (ns) rr t =25c j t =125c j di /dt(a/s) f i =10a f v =160v r figure 9. peak reverse recovery current versus di f /dt (typical values, per diode) figure 10. dynamic parameters versus junction temperature figure 11. thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board fr4, copper thickness: 35 m) for d 2 pak 0 2 4 6 8 10 12 14 16 10 100 1000 i (a) rm t =25c j t =125c j di /dt(a/s) f i =10a f v =160v r 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 i rm q rr t (c) j q; rr i [t ]/q ;i [t =125c] rm j rr rm j i =10a f v =160v r 0 10 20 30 40 50 60 70 80 02468101214161820 s(cu)(cm2) r (c/w) th(j-a)
package information stth2002c 6/11 doc id 10176 rev 2 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value : 0.4 to 0.6 nn in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 6. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 e l2 l1 b1 d a1 c c2 a b e e1 l
stth2002c package information doc id 10176 rev 2 7/11 figure 12. footprint (dimensions in mm) table 7. d 2 pak dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.30 4.60 0.169 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.25 1.40 0.048 0.055 c 0.45 0.60 0.017 0.024 c2 1.21 1.36 0.047 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.28 0.393 0.405 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 r 0.40 0.016 v2 0 8 0 8 g l l3 l2 b b2 e 2mm min. flat zone a c2 d r a2 v2 c a1 16.90 10.30 8.90 3.70 5.08 1.30
package information stth2002c 8/11 doc id 10176 rev 2 table 8. to-220ab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
stth2002c package information doc id 10176 rev 2 9/11 table 9. to-220fpab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.5 0.045 0.059 f2 1.15 1.5 0.045 0.059 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126 h a b dia l7 l6 l5 f1 f2 f d e l4 g1 g l2 l3
ordering information stth2002c 10/11 doc id 10176 rev 2 3 ordering information 4 revision history table 10. ordering information order code marking package weight base qty delivery mode stth2002ct stth2002ct to-220ab 2.23 g 50 tube stth2002cg stth2002cg d 2 pak 1.48 g 50 tube stth2002cg-tr stth2002cg d 2 pak 1.48 g 1000 tape and reel stth2002cr stth2002cr i 2 pak 1.49 g 50 tube STTH2002CFP STTH2002CFP to-220ab 1.70 g 50 tube table 11. document revision history date revision changes feb-2004 1 first issue. 23-jun-2010 2 updated ta b l e 1 . updated ecopack statement.
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